Heat Dissipation Silicone Selection Guide
Exothermic properties, workability, and reduction of total costs! Please select the suitable product from a wide range of products.
Our thermal conductive materials are available in various viscosities and curing types, as well as in packaging. "Thermal Conductive Silicone Adhesives" are suitable for bonding and sealing in hybrid electronic circuit substrates, semiconductor components, heat sinks, and other applications that require complex designs, high manufacturing flexibility, and effective thermal management. Additionally, we offer "Thermal Conductive Silicone Elastomers and Gels," "Thermal Conductive Silicone Compounds," and "Thermal Conductive Silicone Gap Fillers." 【Features】 ■ Superior stability and reliability in a temperature range of -45°C to 200°C ■ Physically robust against mechanical stress caused by thermal cycling or mismatched thermal expansion coefficients ■ Greater elasticity allows for excellent protection against shock and vibration ■ Good moisture bonding stability and chemical resistance *For more details, please refer to the PDF document or feel free to contact us.
